Features
- High I/O Count and Short Interconnects
- High layout density
- Array type lead free solder bump & Cu pillar bump
- Build-up technology & Stack via
- Fine Pattern formation
Specification
- Package Size: 3 x 3 mm up to 15 x 15 mm
- Line & Space 15/15 um
- Bump Pitch down to 100 um
- ETS, Coreless available
