Features
- High density build-up structure
- Via fill plating & stack via available
- Multiple surface finish
- Thin and flat board
Specification
- Package Size: 3 x 3mm up to 19 x 19 mm
- Thickness: 90um for MP, 80um under development
- Ball Pitch: 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm
- Fine line/space : MSAP 20/20um
- Coreless available
